*** ANNOUNCING ***
A closed session will be held on Friday, 27 August, 2021. Information is available under the "EVENT INFO" option on the menu above.
The draft conference schedule is also posted under the "EVENT INFO" menu option.
The safety of all conference participants is our top priority. SCC 2021 will be a fully virtual event and we look forward to gathering in person in 2022.
Since 2006, the Space Computing Conference has gathered engineers, scientists, and computer architects with the objective of advancing the computational capability and reliability of spaceborne systems. The conference will emphasize current and emerging technologies in radiation-tolerant component technologies, processors, memory devices, space-qualifiable packaging technologies, highly-reliable & low-power electronics, avionics systems, etc. The conference aims to cover computing devices and systems for CubeSats up to “Flagship” missions.
The conference will be held August 23rd to the 26th, 2021 online in a fully virtual format.
August 21, 2020 Call for Full Papers and Participation
August 24, 2020 Author Submission Website Open
October 15, 2020 Abstracts Due (extended!)
November 1, 2020 Abstract Acceptance Notification
February 15, 2021 Paper submission due date
April 14, 2021 Early bird registration opens up
May 15, 2021 Authors Acceptance Notification
June 15, 2021 Final Papers and Presentations Due
August 23-26, 2021 Conference
August 27, 2021 Closed Session
We are very thankful for our corporate sponsors - without their support SCC would not be possible. The virtual platform for our event will bring a different and exciting type of engagement between sponsors and our attendees.
A special thank you to our Platinum level sponsor(s).
CAES is a leading developer of mission-critical technologies for commercial, civil, military and intelligence community spacecraft. Our solutions are found on the world’s leading ground systems launch vehicles, satellites, manned and robotic spacecraft, for both traditional and new space applications. CAES capabilities include radiation-hardened (RadHard), radiation tolerant and high-reliability (HiRel) microelectronics, applications-specific integrated circuits (ASICs), advanced packaging solutions, motion control and positioning technologies, antennas and apertures, RF, microwave and millimeter wave microelectronics, power solutions, processors and IP cores.
We recognize our other generous sponsors.